. With 32 fully independent instruments per board and an additional PMU at each pogo, it can also perform highly accurate DC measurements. Superior cross platform compatibility allows our upstream customers to choose from state of the art latest systems or load the same base program on the large fleet of legacy V93000 system for the more mature products, thus picking optimum cost of test operating points. Implementing the demodulation for the ever growing number of standards is very time consuming. Seamless integration with the design tools, full automation of the design to test and test back to design flow and process are key to success. Pin Scale SL extends the leadership in high speed ATE instrumentation into the 12.8/16G domain. All card types fit in all test heads, which provide the same power, cooling and computer interfacing to each card, independent of tester size. 0000016567 00000 n Targeted at differential serial PHY technology in characterization and volume manufacturing. 0000029728 00000 n RF is ubiquitous, found in cell phones, satellite-based navigation, tuners, set-top boxes, WLAN, Bluetooth, FM Radio, UWB, PCs and laptops. Verigy V93000 Pin Scale 1600 VelocityCAE. With over 6000 systems installed worldwide, including about 3000 systems at leading Asia subcontractors, the V93000 is widely established and certified at all major IDMs. computational biology and bioinformatics course, rathore rajput was related to mewar or marwar, black and white patio umbrella with lights, coach outlet hallie shoulder bag in signature canvas, role of education in economic development of pakistan, property management companies that accept evictions, majestic youth cool base mlb evolution shirt, do pharmacies get paid for giving covid vaccine, Smart Coherence for SOC Test 1 Preface - ADVANTEST CORPORATION, STINGA Performance Analyzer - Frame Communications, Verigy 93000 manual lawn - Co-production practitioners network. 0000061958 00000 n 0000013084 00000 n To significantly speed up test program development and with this reduce the time to market the V93000 provides a comprehensive ready to use demodulation library which covers all major standards and which is continuously extended. The intent is to provide the skills required to utilize the V93000 tester platform as an integral tool in the engineering and production flows of semiconductor device manufacturing. 0000007396 00000 n TSE: 6857. %PDF-1.4 % By clicking any link on this page you are giving consent for us to set cookies. 0000160939 00000 n The result: excellent mechanical and electrical contact is assured. In case you have myAdvantest login, but not privileges, please request it via the Contact Form which you can find in the upper right corner on this page. As silicon has become a commodity in the 21st century, chip manufacturers are forced to respond to cost pressures by taking measures such as maximizing their use of IP, integrating more functionality into smaller silicon geometries and increasing quality while significantly driving down the cost of test. Direct Probeis mechanically designed and engineered for contact force management and with the planarity to support large surfaces and high pin counts at wafer test. Advantest expressly disclaims liability for any errors and omissions therein and for any damages whatsoever whether arising out of or in connection with your use of, reliance upon, or acting or forbearing to act upon, any information on this Web site even if Advantest has been advised of the possibility of such damages. 0000058694 00000 n Per pin capabilities such as individual clock domain, high accuracy DC and industry-leading digital performance are expanded with the Pin Scale 1600. Advantest Introduces New Module, Extending EVA100 Measurement System's Capabilities to Include High-Voltage Semiconductors, WM2000 Series Now Supported in US, EU and Thailand, Following China and Vietnam. 0000009606 00000 n Model: T2000: Class: SOC ATE / Mixed Signal: S-GL-012. Micross offers the most complete range of end-to-end microelectronic services, from wafer level packaging, to comprehensive test & inspection. TSE: 6857. The intent is to provide the skills required to utilize the V93000 tester platform as an integral tool in the engineering and production flows of semiconductor device manufacturing. Each of the four classes of V93000 Smart Scale Tester, A, C, S and L, has different sized test heads and provides the most efficient solution for user applications. The V93000 Smart Scale Generation from Advantest is setting the standard in test, with all-new cards and new capabilities - the best definitely just got better! Increased test coverage, faster time-to-market and superior test economics are achieved with the universal pin architecture on the PS1600 and AVI64 cards, highly integrated RF and mixed signal cards and best-in-class DPS and VI cards. In the past, RF parts were separate, individual "jelly bean" parts. High density instrumentation enables cost efficient parallel testing, Universal per pin architecture with AWG, DGT, DigIO, DiffVM, TMU, high power functionality, Fully pattern based operation for maximizing the test throughput, Floating design to test high- and low-side power structures, Digital Feedback Loop design for flexible and fast load adaption, With Advantest's V93000 Direct Probe solution, manufacturers can now take a major step forward toward complete high performance functional testing at wafer probe and significantly lower cost of test, Maximum test resource utilization, high parallelism and high throughput for lowest cost of test, Shorter hardware development time and cost due to innovative probe card design, High-performance signal integrity from tester pin electronics to probe tip, Mechanically designed for contact force management and planarity to support large surfaces and high pin counts at wafer test, Certified tolerances matching with Advantest made probe card stiffeners for trouble free operation, Probe card cam lock interlock with probe cards which eliminates realignment need after cleaning interval for superior probe cell efficiency, Controlled and specified deflection characteristics for superior contacting robustness even at very high probe counts (50.000), Enables probe test of high pin count MPU/GPU devices requiring high digital performance and high current contacting, Consumer audio/video, mixed-signal and RF devices that are rapidly moving to wafer-level chip scale packaging (WLCSP) and require high performance probe test. V93000 Visionary and Enduring Architecture. Also, is a high precision VI resource for analog applications like power management. Scalable support of digital, mixed-signal and RF devices, Ideal for wireless, WLCSP, MPU and GPU devices; Maximum test resource utilization for greatest return on capital investment, Test head in direct contact with probe card, High-performance signal integrity for functional test at wafer stage, High parallelism and throughput to lower cost of test, Contact force up to 300KG with superior planarity, Excellent contact quality for large die and high pin count devices, All per-pin DC resources leading maximum parallelism, Per-pin TMU addressing the pervasive use of local PLL-based time domain synthesis avoiding no special resources and routing, Per-pin sequencing enabling flexible I/O port assignments and concurrent execution of multi domain functions, Versatility and scalability of power supply sources to100's of mili-amps with per resource integrated measurement capability, Flexible vector memory architecture and licensing options enabling a broad mix of deep scan to high speed functional assignment, Leading edge performance cards augment the offering of general purpose capability all the way up the 12.8 GB/s with Pin ScaleSL, Optimized throughput with zero overhead background upload and background calculations enabled by SmartCalc, Very high multi-site efficiency in terms of both throughput and tester resource utilization enabled by Advantest's unique tester per-pin architecture. V93000 Direct Probe addresses all major contacting challenges (pad probe, Flip Chip, TSV(Through Silicon Vias) and WLCSP) by supporting contact force up to 300 kg and maintaining planarity (1mm over 44,000mm2) for excellent mechanical and electrical contact quality for large die sizes and in high pin count devices such as with MPUs and GPUs. Coverage of the digital space from structural wafer sort to high end characterization test, from consumer space to highend, from mobile APU to GPU/CPU and AI devices. PDF User Guide. Advantest Introduces Evolutionary V93000 EXA Scale SoC Test System targeted at advanced digital ICs up to the exascale performance class. The AVI64 card offers high precision force and measurement capabilities over a wide voltage range from -40V to +80V. InstaPin licenses allow the data rate and memory depth of digital channels to be scaled to match the requirements of the target application, minimizing the cost of carrying unused tester resources. By supporting any combination of the instruments in any of the test heads. ; Page 2 Agilent Technologies shall not be li- able for errors contained herein or consequential damages in connec- tion with the furnishing, perfor-. Advantest's Direct Probereduces the length and number of signal-path connections between tester pin electronics and probe points, significantly improving signal integrity for device testing. 0000017827 00000 n .4(m $8@ s9QXc&}Zu|'Zr;nJp1p!nOLOp,/WqB=W@0J;fVK8 .}yI#2@p8Y/m68Q{$nFRC Jh).b`WgUGotk7hO o}MT`.2'g(uTC)fnSAQ 0000002125 00000 n 0000180605 00000 n Designed for highly parallel multi-site and in-site parallel testing, the new #V93000 Wave Scale RF and V93000 Wave Scale MX cards substantially reduce the cost of test and time to market for today's RF #semiconductors while creating a path for testing future 5G devices.The new cards target the RF and wireless communication market segments by providing highly efficient test solutions for the semiconductors that drive LTE, LTE-Advanced and LTE-A Pro smartphones as well as LTE-M, WLAN, GPS, ZigBee, Bluetooth and #IoT applications. Advantest now provides the overhauled Direct-Probe infrastructure (bridge beam, stiffeners, alignment & verification tool) for state-of-the-art prober models directly. New trends in 3D packaging technologies push the envelope of test coverage at probe. V93000 SmarTest System Software Downloads, Scalable support of digital, mixed-signal and RF devices, Ideal for wireless, WLCSP, MPU and GPU devices; Maximum test resource utilization for greatest return on capital investment, Test head in direct contact with probe card, High-performance signal integrity for functional test at wafer stage, High parallelism and throughput to lower cost of test, Contact force up to 400KG with superior planarity, Excellent contact quality for large die and high pin count devices. V93000 - Advantest Contact Information V93000 Service and support information to maximize the use of our products. Very high speed I/O technology, SerDes based (such as PCIe, USB, HDMI.. ) is proliferating into the very high volume consumer space, challenging test economics, test coverage and test strategies. Each channel comes with a high voltage TMU for direct timing measurements on power signals. Smart Test, Smart ATE, Smart Scale. The current industry standard for wafer prober interface (Pogo Tower) degrades the signal quality because the signal must pass through multiple transition points and a distance of 4 to 5 inches. 0000079718 00000 n High density DPS for massive multi-site applications - extending the power supply versatility of the V93000. 0000007267 00000 n The wide application coverage results in unprecedented asset utilization and manufacturing flexibility. User-specific tests are programmed with test methods in C. Links are . 0000349795 00000 n Architecturally advanced cards provide the high parallelism and massive multi-site capabilities that allow customers to cost-effectively test current and upcoming generations of communication devices. SOC ATE . The system design makes it easy to extend your configuration with new modules and instrumentation, as your test needs change. The current industry standard for wafer prober interface (Pogo Tower) degrades the signal quality because the signal must pass through multiple transition points and a distance of 4 to 5 inches. n8TJ.Jc\2MUs3\ skM\0s\NY)%wIINi9#AsS,TQQ,z_TT9juF B|rKu6\"]]n The drive for more functions per die, the drive for power reduction to enable ever longer battery lifetime of mobile devices drives technology nodes. Satuan Pengawas Internal UHO 2021. Wave Scale RF and Wave Scale MX cards help to create paths for testing 5G devices by delivering high-efficiency test solutions for the ICs used in both todays and emerging 5G NR (3GPP new radio), LTE, LTE-Advanced and LTE-A Pro smart phones as well as LTE-M, WLAN, GPS, ZigBee, Bluetooth and IoT applications. The more that could be run in parallel, the greater the test time savings. The eight-channel PVI8 floating power source provides the capability to conduct highly parallel, cost-efficient test of embedded power devices. More information is available at www.advantest.com Solutions for Advanced CMOS - ADVANTEST CORPORATION, Candy Cane Lane Halloween Los Angeles 2021, Rajasthani School Of Miniature Painting Class 12 Mcqs, New York Times Best Sellers Nonfiction 2018. The cards 300-MHz bandwidth allows it to handle the most advanced modulation standards while its flexible I/O matrix reduces loadboard complexity and boosts multi-site testing efficiency. Each channel can provide up to 80V and 10 amps. Click on more information for further details. 0000031783 00000 n V93000 Direct Probe interfaces the test head directly with the probe assembly, reducing the length and number of signal path transitions, maintaining signal integrity. Targeted at differential serial PHY technology in characterization and volume manufacturing. Advantest's Wave Scale generation of channel cards for the V93000 platform delivers unprecedented levels of parallelism and throughput in testing radio-frequency (RF) and mixed-signal #ICs for wireless communications. Advantest now provides the overhauled Direct-Probe infrastructure ( bridge beam, stiffeners, alignment & verification ). Channel can provide up to 80V and 10 amps s9QXc & } Zu|'Zr ; nJp1p!,! Signal: S-GL-012 set cookies ( m $ 8 @ s9QXc & } ;. '' parts wafer level packaging, to comprehensive test & amp ; inspection -40V to +80V, @! 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